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Product Detailed Parameters
- Description：CONN EDGE DUAL FMALE 66POS 0.156
- Series：306
- Mfr：EDAC Inc.
- Package：Bulk
- Card Type：Non Specified - Dual Edge
- Gender：Female
- Number of Positions/Bay/Row：33
- Number of Positions：66
- Card Thickness：0.054" ~ 0.070" (1.37mm ~ 1.78mm)
- Number of Rows：2
- Pitch：0.156" (3.96mm)
- Read Out：Dual
- Features：-
- Mounting Type：Panel Mount
- Termination：Solder Eyelet(s)
- Contact Material：Copper Alloy
- Contact Finish：Tin
- Contact Finish Thickness：-
- Contact Type：Cantilever
- Color：Green
- Flange Feature：Flush Mount, Side Opening, Unthreaded, 0.128" (3.25mm) Dia
- Operating Temperature：-40°C ~ 105°C
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Overview
The EDAC Inc. model 306-033-400-112 is a standard card edge connector designed for vertical panel mounting applications. This component features 66 positions with a contact spacing of 0.156 inches (3.96 mm). It utilizes a dual-edge configuration and accepts printed circuit boards with a nominal thickness of 0.062 inches (1.57 mm). The contacts are tin-plated copper alloy, rated for 5 A current, while the insulator body is constructed from green thermoplastic material.
Feature Summary
- Vertical panel mount design for secure structural integration
- Dual-edge interface supporting standard PCB thicknesses
- Tin-plated contacts ensuring reliable electrical conductivity
Applications
- Industrial control system interconnects
- Computing and storage hardware backplanes
- Aerospace electronic module connections
Procurement Notes
Verify the specific ordering suffix to confirm contact plating type, as variations exist within the series. Confirm that the target application requires dual-edge termination rather than single-edge variants. Ensure the PCB fabrication tolerances align with the specified board thickness acceptance range. Cross-reference the position count against schematic requirements to prevent mismatched pin counts during assembly.
Selection Notes
Select this connector when a high-density vertical interface is required for robust mechanical stability. The 3.96 mm pitch accommodates substantial signal routing needs compared to finer pitches. Tin plating offers cost-effective performance for general industrial environments where corrosion resistance is moderate. Evaluate thermal operating ranges to ensure compatibility with the intended deployment conditions.
Part Context
This component belongs to the EDAC 306 series, which provides extensive customization options for card edge applications. The series supports various position counts and mounting styles to meet diverse OEM requirements. EDAC manufactures these connectors for global distribution channels serving computing, medical, and communications sectors.
Replacement Considerations
Compatible substitutes include other EDAC 306 series variants with matching 66-position counts and 3.96 mm pitch. Verify that alternative models maintain the same vertical panel mount orientation and dual-edge termination style. Ensure physical dimensions and PCB thickness specifications remain identical to guarantee proper fit.
