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The EDAC Inc. 306-035-400-101 is a standard card edge connector from the 306 series, designed for panel mounting applications. It features a dual female configuration with 35 positions arranged in two rows. The connector utilizes a 0.156-inch (3.96mm) pitch and accepts card thicknesses ranging from 0.054 to 0.070 inches. Contact surfaces are gold-plated copper alloy cantilever springs, housed in green thermoplastic polyester insulation. It supports solder termination via eyelets and operates within a temperature range of -40°C to 105°C.
Verify the specific ordering suffix against the manufacturer's current 306 Series Ordering Guide to ensure compatibility with required flange styles and termination types. Confirm that the requested part number matches the exact pin count and pitch specifications required for the target application. Cross-reference the component status to confirm availability and lead times through authorized distribution channels prior to finalizing procurement plans.
Select this component when a dual-row card edge interface with a 0.156-inch pitch is required for panel-mounted installations. Ensure the mating card thickness falls within the specified 0.054 to 0.070-inch range to guarantee proper contact engagement. Consider the operating temperature range and material composition if the environment presents thermal or chemical stressors beyond standard conditions.
This component belongs to the EDAC 306 series of standard card edge connectors, which are widely used in various electronic assemblies requiring robust vertical interconnects. The series offers multiple position counts and termination options to accommodate diverse board layout requirements. As a standard product, it provides a balance of performance and cost-effectiveness for general-purpose industrial and commercial applications.
Compatible substitutes include other EDAC 306 series variants with matching 35-position dual-row configurations. Verify that alternative parts maintain the same 0.156-inch pitch and compatible flange dimensions to ensure mechanical interchangeability without modifying the host panel structure.