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337-025-540-168 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE SGL FMALE 25POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 337-025-540-168 is a standard card edge connector designed for through-hole mounting with a vertical orientation. It features 25 positions and a pitch of 3.96 mm (0.156 inch). The component utilizes gold-plated copper alloy contacts and wire wrap termination. It supports a PCB thickness of 1.57 mm and has a current rating of 3 A. The housing is constructed from thermoplastic polyester, and the unit operates within a temperature range of -40 C to +105 C.
Verify the specific suffix code against official EDAC documentation to confirm exact plating thickness and flange specifications. Confirm RoHS compliance status directly with the manufacturer or authorized distributor prior to procurement. Ensure the ordering suffix matches the required insulation color and terminal type variations documented in the official datasheet.
Select this model for applications requiring a single-row, 25-position interface with a 3.96 mm pitch. The vertical design suits board-to-board connections where space constraints favor a perpendicular layout. Verify that the target printed circuit board accommodates the specified 1.57 mm thickness requirement for proper engagement.
This component belongs to the EDAC 337 series of standard card edge connectors. The series offers various position counts and mounting orientations. This specific part number represents a 25-position variant optimized for vertical through-hole assembly with wire wrap terminals.
Consult official EDAC cross-reference lists for verified substitutes. Generic equivalents may not match the precise 3.96 mm pitch or wire wrap termination requirements.
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