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357-027-558-103 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE SGL FMALE 27POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 357-027-558-103 is a standard card edge connector from the 357 series, designed for vertical board-to-board connections. It features 27 positions with a 3.96 mm (0.156 inch) pitch and supports a maximum PCB thickness of 1.57 mm. The contacts are gold-plated copper alloy to ensure reliable signal transmission. This single-row connector utilizes a solder pin termination method for secure mounting on printed circuit boards.
Verify the specific ordering suffix against the official EDAC datasheet to confirm exact contact configuration and plating specifications. Ensure compatibility with the target PCB stack-up and hole dimensions before procurement. Confirm RoHS compliance status through the manufacturer's latest documentation to meet regulatory requirements for your specific application region.
Select this component when a vertical, single-edge connector with a 3.96 mm pitch is required. It is suitable for applications needing 27 signal paths with high durability. Consider the 1.57 mm PCB thickness constraint during mechanical design. Verify that the solder pin termination aligns with your assembly process capabilities and thermal profile requirements.
This part belongs to the EDAC 357 series of standard card edge connectors, which are widely used in industrial and commercial electronics. The series offers various position counts and mounting styles. The 357-027-558-103 specifically addresses the need for mid-range density connections with reliable gold-contact performance in vertical configurations.
Direct substitutes within the same series include parts like 357-028-545-101 or 357-010-527-103, provided the position count matches the design requirement. Always cross-reference the dimensional drawings and electrical ratings before swapping components to ensure mechanical fit and functional equivalence.
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