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357-056-500-201 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE DUAL FMALE 56POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 357-056-500-201 is a standard card edge connector featuring 56 positions arranged in a dual-edge configuration. It utilizes a 3.96 mm (0.156 inch) pitch and accepts circuit boards with thicknesses ranging from 0.054 to 0.070 inches. The contacts are gold-plated copper alloy, ensuring reliable signal transmission. Designed for vertical mounting, this component belongs to the EDAC 357 series and is constructed with a thermoplastic polyester housing.
Verify the specific manufacturer part number against official EDAC documentation to confirm compatibility with target PCB thickness and mounting requirements. Ensure that the dual-edge configuration aligns with the design specifications of the intended application. Cross-reference RoHS compliance status through authorized channels prior to procurement.
Select this component when a high-density connection with a 3.96 mm pitch is required for dual-sided card edge interfaces. Consider the vertical mounting style and gold plating for applications demanding durability and low contact resistance. Validate that the target PCB thickness falls within the specified acceptance range before finalizing the selection.
This connector is part of the EDAC 357 series, which offers a comprehensive range of standard card edge connectors. The series is designed to provide reliable interconnect solutions for various industries, including medical and agricultural sectors. The 357-056-500-201 variant specifically addresses needs for 56-position connections with robust mechanical and electrical properties.
Consult official EDAC substitution guides for verified alternative part numbers within the 357 series or other compatible families. Ensure any substitute matches the 56-position count, 3.96 mm pitch, and dual-edge configuration. Verify dimensional compatibility and electrical ratings before implementation.
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