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396-062-555-808 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE DUAL FMALE 62POS 0.125. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 396-062-555-808 is a standard card edge connector designed for dual-edge board insertion. It features 62 positions with a 3.175 mm pitch and supports a board thickness of 1.57 mm. The contacts are gold-plated copper alloy, ensuring reliable signal transmission. This receptacle utilizes solder pin termination for secure PCB mounting.
Verify the specific RoHS compliance status and environmental certifications directly with the manufacturer or authorized distributors before integration. Confirm that the current supply chain availability aligns with project timelines, as distribution channels may vary by region. Ensure all technical specifications match the system requirements to avoid compatibility issues during assembly.
Select this component when a dual-edge configuration is required for 62-position signal routing. The 3.175 mm pitch accommodates standard board layouts, while the vertical orientation facilitates direct panel or board stacking. Gold plating is essential for applications prioritizing long-term contact reliability and low insertion force.
This part belongs to the EDAC 396 series, which specializes in standard card edge connectors. The series offers various position counts and termination styles to support diverse electronic packaging needs. EDAC designs these components to meet rigorous performance standards across multiple industrial sectors.
Cross-reference compatible parts within the EDAC 396 series for alternative position counts. Verify that substitute models maintain identical pitch, board thickness tolerance, and termination type to ensure mechanical and electrical interchangeability without redesigning the host PCB.
The contacts are made from copper alloy and feature gold plating.
It is designed as a dual-edge female connector for simultaneous board engagement.
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