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The onsemi 4N30S is a single-channel transistor output photodarlington optocoupler designed for general-purpose isolation applications. It features an infrared emitting diode coupled to a high-gain photodarlington output, housed in a compact SMD-DIP-6 package. Key electrical parameters include a maximum collector-emitter voltage of 30 V and a peak forward current rating of 80 mA. The device offers a minimum current transfer ratio of 100% and operates within a temperature range of -40°C to +100°C. With an insulation voltage of 4170 Vrms, it provides robust signal isolation while maintaining low power dissipation characteristics suitable for surface-mount assembly.
Verify the specific suffix designation against official datasheets to confirm package type and tape-and-reel specifications. Confirm RoHS compliance status and lead times directly with authorized distributors or the manufacturer. Ensure the ordering part number matches the required operating temperature range and isolation voltage ratings for the target application environment.
Select this component when a compact surface-mount solution is required for isolating low-voltage digital signals. The photodarlington output offers higher current gain compared to standard phototransistor outputs, making it suitable for driving loads directly without additional amplification. Consider the 30 V collector-emitter voltage limit and 150 mA maximum collector current when designing the output stage circuitry.
The 4N30S belongs to the broader 4N30M family of transistor output optocouplers manufactured by onsemi. This series is widely recognized for providing reliable galvanic isolation between input and output circuits. The 'S' suffix typically denotes the surface-mount variant, distinguishing it from through-hole packages while maintaining similar electrical performance characteristics within the same product line.
Cross-reference with other 6-pin SMD photodarlington optocouplers offering comparable isolation voltages and current transfer ratios. Verify pinout compatibility and thermal resistance values before substituting to ensure mechanical fit and electrical performance alignment.