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The Broadcom Limited 5962-8876904KYA is a high-speed, hermetically sealed optocoupler designed for demanding environments. It features two independent channels within an SOIC-8 surface-mount package. The device supports data rates up to 5 Mb/s with a forward current of 8 mA and a forward voltage of 1.3 V. Electrical performance includes a rise time of 45 ns and a fall time of 10 ns, delivering an output current of 15 mA. Power dissipation is rated at 200 mW. The component operates reliably across a wide temperature range from -55°C to +125°C.
Verify the specific suffix KYA against official datasheets to confirm package type and material specifications. Ensure compatibility with existing PCB footprints for SOIC-8 SMD mounting. Confirm that the hermetic seal integrity meets project requirements for environmental protection. Validate thermal management capabilities given the 200 mW power dissipation rating under maximum operating conditions.
Choose this component when dual-channel isolation and high-speed data transmission are required in sealed environments. The 5 Mb/s data rate suits moderate-speed digital communication needs. Consider the -55°C to +125°C operating range for extreme temperature applications. The push-pull output drives loads directly without additional buffering. Evaluate the SOIC-8 footprint against available board space constraints.
This part belongs to the 5962-88769 series of high-speed optocouplers manufactured by Broadcom Limited. The series is characterized by hermetic packaging options suitable for DLA Class K reliability standards. These devices bridge the gap between standard plastic optocouplers and specialized military-grade components. The 5962 prefix indicates compliance with Department of Defense procurement standards.
Cross-reference with other 5962-88769 variants such as 5962-8876904K for DIP ceramic packages. Verify pinout compatibility before substituting with different channel counts or output types. Check if alternative hermetic packages meet the same thermal and electrical specifications.