5SGSMD4H2F35I3G

Overview

The Altera 5SGSMD4H2F35I3G is a Stratix V GS Field Programmable Gate Array featuring 360,000 logic elements and 135,840 adaptive logic modules. It integrates 19,456,000 bits of total embedded memory and supports 432 I/Os within a 1152-ball FCBGA package. The device operates with a supply voltage range of 0.82V to 0.88V and functions across a junction temperature range of -40°C to 100°C.

Feature Summary

• High-density programmable logic fabric with extensive embedded memory resources
• Supports high-speed serial data transmission via integrated transceivers
• Designed for demanding industrial and commercial environments with wide temperature tolerance

Applications

• High-performance telecommunications infrastructure equipment
• Industrial automation and control systems requiring deterministic processing
• Medical imaging and diagnostic system signal processing
• Test and measurement instrumentation requiring flexible logic architectures

Procurement Notes

Verify the specific suffix codes against official Intel/Altera documentation to ensure correct speed grade, temperature rating, and packaging configuration. Confirm RoHS compliance status and moisture sensitivity level requirements prior to integration. Check for any product change notices regarding label updates or software toolchain dependencies that may affect long-term availability and design continuity.

Selection Notes

Select this component when high logic density and substantial embedded memory are required within a compact form factor. Ensure the design utilizes the Quartus Prime software suite for compilation and implementation. Verify that the power delivery network can support the specified core voltage range and thermal management strategies accommodate the operating temperature limits for reliable performance.

Part Context

This part belongs to the Stratix V GS family, targeting cost-sensitive applications while maintaining high performance. It shares architectural similarities with other Stratix V devices but offers optimized resource configurations. The 1152-ball package provides necessary I/O flexibility for complex system interconnects.

Replacement Considerations

Direct pin-to-pin replacements within the same family require matching logic element counts and package dimensions. Verify compatibility with existing board layouts and thermal profiles. Consult official substitution guides for any functional equivalents that maintain identical electrical characteristics and software compatibility.