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Product Detailed Parameters
- Description:IC FPGA 696 I/O 1517FBGA
- Series:Stratix® V GS
- Mfr:Altera
- Package:Tray
- Number of LABs/CLBs:135840
- Number of Logic Elements/Cells:360000
- Total RAM Bits:19456000
- Number of I/O:696
- Voltage - Supply:0.82V ~ 0.88V
- Mounting Type:Surface Mount
- Operating Temperature:-40°C ~ 100°C (TJ)
- Package / Case:1517-BBGA, FCBGA
- Supplier Device Package:1517-FBGA (40x40)
- Number of Gates:-
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Overview
The Altera 5SGSMD4K2F40I2LN is a Stratix V GS Field Programmable Gate Array (FPGA) featuring 360,000 logic elements and 13,584 LABs. It integrates 19 Mbit of embedded memory and supports up to 696 I/Os. The device operates within a supply voltage range of 0.82V to 0.88V and functions at temperatures between -40°C and +100°C TJ. It utilizes a 1517-ball FCBGA package.
Feature Summary
- Stratix V GS architecture optimized for power efficiency
- High-density programmable logic fabric with extensive embedded memory
- Support for high-speed serial transceivers
- Industrial temperature range operation capability
Applications
- Telecommunications infrastructure equipment
- Data center interconnect solutions
- Industrial automation control systems
- Test and measurement instrumentation
Procurement Notes
Verify the specific suffix 'LN' against official Intel/Altera documentation, as standard listings often cite 'LG'. Confirm RoHS compliance status and moisture sensitivity level (MSL 3) requirements for your assembly process. Ensure the source provides valid traceability for this discontinued or legacy component series.
Selection Notes
Compare total logic capacity and memory bandwidth against current Intel Agilex or Stratix 10 families for modern designs. Evaluate pin compatibility if replacing older Stratix V variants. Consider thermal management requirements due to the high density of logic elements in the 1517-ball package form factor.
Part Context
This component belongs to the Stratix V GS family, designed for low-power, high-performance applications. It succeeds previous generations by offering improved energy efficiency per logic element while maintaining robust connectivity options for complex system-on-chip implementations.
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