5SGSMD6K3F40I4G

Overview

The Altera 5SGSMD6K3F40I4G is a Stratix V GS Field Programmable Gate Array featuring 583,000 logic elements and 220,000 adaptive logic modules. It integrates 46,080,000 bits of embedded memory and supports 696 I/Os via a 1517-ball FCBGA package. The device operates with a supply voltage range of 0.82V to 0.88V and functions within a junction temperature range of -40°C to 100°C.

Feature Summary

• High-density programmable logic architecture with extensive embedded memory resources
• Support for high-speed serial data transmission through integrated transceivers
• Industrial-grade thermal performance suitable for demanding operational environments

Applications

• Complex digital signal processing systems requiring high throughput
• Telecommunications infrastructure equipment and baseband processing
• Industrial automation controllers and motion control systems
• Medical imaging hardware and diagnostic equipment interfaces

Procurement Notes

Verify component authenticity through authorized distribution channels or direct manufacturer engagement. Confirm RoHS compliance status and moisture sensitivity level prior to assembly planning. Ensure storage conditions adhere to JESD22-A113 standards to prevent humidity-induced damage during surface mount placement processes.

Selection Notes

Evaluate the specific logic density and memory bandwidth requirements against the available 583,000 logic elements and 46 Mbit memory capacity. Assess thermal management needs given the 100°C maximum junction temperature limit. Compare pin count and I/O flexibility with alternative Stratix V variants to ensure optimal package utilization and system integration efficiency.

Part Context

This component belongs to the Stratix V GS family, designed for cost-sensitive applications requiring robust performance. It shares architectural similarities with other Stratix V devices but offers optimized resource allocation for general-purpose high-volume deployments. The part number suffix indicates specific speed grades and packaging configurations.