6455-JE-3X5-RC

Overview

The Critical Link MityDSP-Pro model 6455-JE-3X5-RC is a System-on-Module processor card featuring a Texas Instruments TMS320C645x DSP running at 1.2 GHz with 2 MB L2 cache, integrated into a Xilinx Spartan 3 XC3S4000 FPGA. The module provides 128 MB of CPU DDR2 SDRAM and 64 MB of FPGA DDR1 SDRAM, alongside 16 MB of NOR Flash. It utilizes an SO-DIMM-200 interface for connectivity, including 140 configurable FPGA I/O pins, two McBSP interfaces, I2C, and 10/100 Ethernet. Designed for commercial operation between 0°C and 70°C, the card supports JTAG debugging and expansion via RapidIO, PCI, and Gigabit Ethernet RGMII.

Feature Summary

• Texas Instruments TMS320C645x DSP operating at 1.2 GHz with 2 MB L2 cache
• Xilinx Spartan 3 XC3S4000 FPGA with 140 user I/O lines across four voltage-configurable banks
• 128 MB CPU DDR2 SDRAM and 64 MB FPGA DDR1 SDRAM memory subsystems
• SO-DIMM-200 form factor with integrated 10/100 Ethernet PHY and dual McBSP ports

Applications

• Embedded instrumentation systems
• Real-time digital signal processing tasks
• Audio and video processing applications
• Rapid prototyping and deployment environments

Procurement Notes

Verify the specific ordering suffix against the manufacturer's current documentation to confirm hardware revisions and regional compliance details. Confirm that the commercial temperature range (0°C to 70°C) aligns with the intended operational environment requirements before finalizing procurement specifications.

Selection Notes

Select this model when a 1.2 GHz DSP clock speed and the larger XC3S4000 FPGA capacity are required for complex logic implementations. Ensure the application fits within the commercial temperature limits; industrial variants (-40°C to +85°C) exist under different part numbers if extended thermal performance is necessary.

Part Context

This component belongs to the MityDSP-Pro family of customizable processing platforms designed by Critical Link. These modules integrate TI DSPs with Xilinx FPGAs to provide a complete embedded development infrastructure. The platform supports software development using TI Code Composer Studio and Xilinx ISE tools, facilitating rapid integration of custom firmware and application logic.

Replacement Considerations

For industrial temperature requirements, consider the 6455-IE-3X5-RI variant which maintains identical electrical specifications but operates from -40°C to +85°C. Lower frequency options such as the 6454-GD-3X5-RC offer 720 MHz processing with the smaller XC3S2000 FPGA.