66AK2E05XABDA25

66AK2E05XABDA25

$181.24
  • Description:66AK2E05XABDA25
  • Series:66AK2E0x KeyStone Multicore

SKU:3783eb86e7c4 Category: Brand:

  
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Product Detailed Parameters

  • Description:66AK2E05XABDA25
  • Series:66AK2E0x KeyStone Multicore
  • Mfr:Texas Instruments
  • Package:Tray
  • Type:DSP+ARM®
  • Interface:EBI/EMI, Ethernet, DMA, I2C, MDIO, PCIe, TSIP, SPI, UART/USART, USB 3.0, USIM
  • Clock Rate:1.25GHz
  • Non-Volatile Memory:ROM (256kB)
  • On-Chip RAM:2MB
  • Voltage - I/O:1.35V, 1.5V, 1.8V, 3.3V
  • Voltage - Core:Variable
  • Operating Temperature:-40°C ~ 100°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:1089-BFBGA, FCBGA
  • Supplier Device Package:1089-FCBGA (27x27)
  • Grade:-
  • Qualification:-

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66AK2E05XABDA25

Overview

The Texas Instruments 66AK2E05XABDA25 is a multicore System-on-Chip based on the KeyStone II architecture. It integrates up to four ARM Cortex-A15 processor cores and one TMS320C66x DSP core, both operating at frequencies up to 1.4 GHz. The device features 4 MB of shared L2 cache for the ARM cores and 512 KB of local L2 memory per DSP core. It includes a 72-bit DDR3/DDR3L interface supporting speeds up to 1600 MTPS, two PCIe Gen2 controllers, and extensive I/O including an 8-port Gigabit Ethernet switch and a 2-port 10-Gigabit Ethernet switch. The component is housed in a 1089-pin BGA package.

Feature Summary

  • Integrated ARM Cortex-A15 quad-core cluster with 4 MB shared L2 cache
  • Single C66x DSP CorePac delivering 38.4 GMacs/core at 1.2 GHz
  • Multicore Shared Memory Controller (MSMC) with 2 MB SRAM
  • Dual Ethernet subsystems: 8-port GbE switch and 2-port 10GbE switch

Applications

  • Avionics and defense systems
  • Enterprise networking equipment
  • Data center infrastructure

Procurement Notes

Verify the specific ordering suffix against the manufacturer's current nomenclature guide, as variations may indicate differences in temperature range or packaging. Confirm that the required security accelerator functions are enabled for the specific shipment, as these features are subject to export control regulations and may not be active on all units.

Selection Notes

Select this model when high-throughput Layer 1 and Layer 2 processing is required within a unified platform. The device supports extended case temperatures ranging from -40°C to 100°C. Ensure the design accommodates the 28 nm process technology requirements and utilizes the SmartReflex automatic voltage scaling for power optimization across the ARM and DSP domains.

Part Context

This component belongs to the 66AK2E0x family, which implements the KeyStone II multicore architecture. It serves as an evolution of previous KeyStone devices by doubling DSP core counts and integrating ARM Cortex-A15 processors. The architecture emphasizes low-latency communication via TeraNet and HyperLink interconnects, designed for scalable embedded processing solutions.

Replacement Considerations

The 66AK2E02 is a related variant within the same family featuring only one ARM Cortex-A15 core instead of four. Designers requiring reduced core count but similar peripheral interfaces may consider this alternative, though pin compatibility and software partitioning must be validated.

66AK2E05XABDA2566AK2E05XABDA25
$181.24
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