66AK2G12ABY100

66AK2G12ABY100

$44.02
  • Description:GALILEO FLIPCHIP
  • Series:66AK2G1x KeyStone II Multicore

SKU:49e0b2ab490f Category: Brand:

  
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Product Detailed Parameters

  • Description:GALILEO FLIPCHIP
  • Series:66AK2G1x KeyStone II Multicore
  • Mfr:Texas Instruments
  • Package:Tray
  • Type:DSP+ARM®
  • Interface:CAN, DMA, EBI/EMI, Ethernet, I2C, McASP, McBSP, MMC/SD, QSPI, SPI, UART, USB
  • Clock Rate:1GHz
  • Non-Volatile Memory:External
  • On-Chip RAM:1MB
  • Voltage - I/O:1.8V, 3.3V
  • Voltage - Core:1.00V
  • Operating Temperature:0°C ~ 90°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:625-LFBGA, FCBGA
  • Supplier Device Package:625-FCBGA (21x21)
  • Grade:-
  • Qualification:-

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66AK2G12ABY100

Overview

The Texas Instruments 66AK2G12ABY100 is a multicore System-on-Chip (SoC) based on the Keystone II architecture, integrating an Arm Cortex-A15 subsystem and a C66x VLIW DSP core. Both processors operate at up to 1 GHz. The device includes two Programmable Real-Time Unit and Industrial Communication Subsystems (PRU-ICSS), a Network Subsystem with EMAC and crypto acceleration, and a Display Subsystem. It features extensive memory protection via ECC for L1/L2 caches and shared SRAM, supporting DDR3L external memory. The component is housed in a 625-ball FCBGA package.

Feature Summary

  • Dual-core processing: Arm Cortex-A15 and C66x DSP cores running at up to 1 GHz
  • Industrial control integration: Two PRU-ICSS modules with dedicated Ethernet MACs
  • Robust memory architecture: MSMC with 1MB shared SRAM and 36-bit DDR3L EMIF with ECC support
  • Comprehensive connectivity: PCIe Gen2, dual USB 2.0, QSPI, MMC/SD, CAN, and multiple serial interfaces

Applications

  • Industrial Communications and Controls
  • Home Audio Systems
  • Professional Audio Equipment
  • Protection Relays
  • Industrial Transport

Procurement Notes

Verify the specific speed grade suffix (e.g., '100' indicating 1 GHz operation) against the datasheet Table 5-1 to ensure performance requirements are met. Confirm the operating temperature range corresponds to the required industrial or commercial environment. Ensure ESD precautions are observed during handling due to moisture sensitivity classification.

Selection Notes

Select this SoC for applications requiring heterogeneous processing between real-time deterministic control (via PRUs) and high-level OS execution (Arm/DSP). Evaluate the available GPIO count (up to 212) and peripheral availability against system interface needs. Consider the thermal dissipation requirements of the 625-FCBGA package when designing the PCB layout.

Part Context

This part belongs to the 66AK2G1x family of Keystone II-based SoCs. It shares architectural similarities with other devices in the series but differs in specific memory sizes and peripheral configurations. Development typically utilizes the Processor SDK Linux and Code Composer Studio IDE for software implementation.

Replacement Considerations

Consult TI documentation for compatible upgrades within the 66AK2G1x family. Verify pin-to-pin compatibility and electrical specifications before substituting with other variants.

66AK2G12ABY10066AK2G12ABY100
$44.02
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