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Product Detailed Parameters
- Description：7K DMIPS ARM DUAL 4K HEVC VP9
- Series：-
- Mfr：Broadcom Limited
- Package：Bulk
- Function：-
- Frequency：-
- RF Type：-
- Secondary Attributes：-
- Mounting Type：-
- Package / Case：-
- Supplier Device Package：-
- Grade：-
- Qualification：-
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Overview
The Broadcom Limited 72604ZBKFEBB3 is an RF System-on-Chip (SoC) designed for high-performance multimedia applications. It integrates dual ARM processor cores delivering approximately 7K DMIPS performance, supporting 4K video decoding capabilities including HEVC and VP9 standards. This component functions as a network controller and processor IC, combining processing power with RF functionality in a single package to facilitate efficient data handling and media streaming.
Feature Summary
- Integrates dual-core ARM processors for robust computational throughput
- Supports advanced 4K video decoding formats such as HEVC and VP9
- Combines network control and processing functions within a single SoC architecture
Applications
- High-definition multimedia streaming devices
- Network-enabled consumer electronics
- Smart home gateway controllers
Procurement Notes
Verify current availability status carefully as this component may be subject to obsolescence or limited supply conditions. Confirm the exact ordering suffix matches required specifications. Check official manufacturer documentation for any product change notices or end-of-life announcements prior to procurement planning.
Selection Notes
Select this component when a combined RF and processing solution is required for 4K media applications. Ensure compatibility with existing ARM-based software ecosystems. Evaluate thermal management requirements due to integrated processing density. Verify that the specific package variant meets board layout constraints.
Part Context
This part belongs to Broadcom's family of RF mixed-signal SoCs targeting multimedia and networking markets. It represents a convergence of wireless connectivity and high-performance computing capabilities. The 72604 series is designed to replace discrete processor and RF chip solutions, reducing bill of materials complexity in modern electronic devices.
Replacement Considerations
Publicly confirmed substitute part numbers are not available in the provided source material. Consult official Broadcom channels for potential obsolescence management options or recommended replacements.
