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The 73M2901CE-IGVR/F is a V.22bis single-chip modem integrating a data pump, controller, and analog front end in a 32-pin TQFP package. It operates on a 2.7 V to 3.6 V supply with typical current draw of 9.5 mA at 3.0 V. The device supports asynchronous and synchronous serial interfaces and includes an internal hybrid driver. Key capabilities include DTMF generation/detection, worldwide Caller ID support, and SMS messaging. It features low-power standby and power-down modes, reducing consumption to approximately 10 µA.
Verify the specific suffix IGVR/F against official documentation to confirm the TQFP-32 package type and industrial temperature range. Confirm availability status as this component may be subject to discontinuation or limited supply conditions. Ensure compatibility with existing host interface requirements before procurement.
Select this model when a complete embedded modem solution is required without external DSPs. It is suitable for designs needing pin compatibility with the 73M2901CL hard modem or the 73M1903 soft modem AFE. Consider the 32-pin TQFP package if through-hole or larger surface-mount footprints are preferred over QFN options.
The 73M2901CE belongs to the Teridian/Maxim Integrated 73M2901 family of low-speed modems. It serves as a cost-effective alternative to discrete modem solutions by combining analog and digital functions. The device is backward compatible with the 73M2901CL, allowing for flexible design transitions between hard and soft modem architectures within the same system platform.
The 73M2901CL is a pin-compatible alternative offering similar functionality in a different package variant. Designers should verify that any replacement maintains the required serial interface timing and voltage levels.