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74ALVC373D,118 is listed in the Latches range at ChipApex. The manufacturer field lists Nexperia USA Inc.. Its product description is IC D-TYPE TRANSP SGL 8:8 20SO. Review the specifications below when checking this part for your BOM.
The Nexperia 74ALVC373D,118 is an octal D-type transparent latch with 3-state outputs housed in a SO20 plastic small outline package (SOT163-1). It operates within a supply voltage range of 1.65 V to 3.6 V and supports ambient temperatures from -40 °C to +125 °C. Propagation delay ranges from 1.0 ns to 6.9 ns depending on voltage and temperature. The device includes IOFF circuitry for partial power-down applications, preventing backflow current when powered down.
Verify the specific ordering suffix matches the required package type, as the 74ALVC373 series is available in multiple configurations including TSSOP20 and DHVQFN20. Confirm the temperature grade corresponds to your operational requirements, as specifications vary between -40 °C to +85 °C and -40 °C to +125 °C. Ensure input voltage limits are respected to avoid exceeding absolute maximum ratings.
Select this component for designs requiring high-speed data latching with low power consumption. The wide supply voltage range allows flexibility in system architecture. Consider the SO20 package dimensions if board space permits, noting alternative packages like TSSOP20 are available for tighter layouts. Verify ESD protection requirements against HBM and CDM standards specified in the datasheet.
This part belongs to the 74ALVC family of logic devices, designed for low-voltage CMOS applications. It serves as an octal latch variant within the broader 74-series logic ecosystem. The ALVC series emphasizes speed and low power dissipation compared to standard HC or HCT counterparts, making it suitable for modern digital systems operating at reduced voltages.
Direct pin-compatible alternatives include the 74ALVC373PW (TSSOP20) and 74ALVC373BQ (DHVQFN20). Cross-family replacements such as 74HC373 or 74LVC373 may require voltage level adjustments and do not share identical electrical characteristics or package footprints.
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