74ALVT16501DGG,112

Overview

The 74ALVT16501DGG,112 is an 18-bit universal bus transceiver manufactured by Nexperia (formerly NXP Standard Products). It utilizes BiCMOS technology and operates at VCC voltages of 2.5 V or 3.3 V with I/O compatibility up to 5 V. The device features non-inverting 3-state outputs in both send and receive directions, controlled by OEAB, OEBA, LEAB, LEBA, CPAB, and CPBA inputs. It includes active bus hold circuitry for unused inputs and supports live insertion/extraction. The component is housed in a TSSOP56 package (SOT364-1) and operates within a temperature range of -40 °C to +85 °C.

Feature Summary

• 18-bit bidirectional bus interface with 5 V I/O compatibility
• Active bus hold data inputs eliminate the need for external pull-up resistors
• Positive-edge triggered clock inputs with power-up reset and 3-state functionality
• Latch-up protection exceeding 500 mA per JESD78 standard

Applications

• High-performance bi-directional data bus interfaces
• Systems requiring live insertion and extraction capabilities
• Universal bus transceivers operating at 2.5 V or 3.3 V logic levels

Procurement Notes

Verify that the ordering suffix ',112' corresponds to the specific tape and reel packaging configuration defined in the manufacturer's current ordering information table. Confirm the component status as 'Product' rather than obsolete or development stages before finalizing procurement plans. Ensure the TSSOP56 package variant matches the design footprint requirements.

Selection Notes

Select this component when an 18-bit wide bidirectional interface is required with 5 V tolerance on I/O pins while core logic operates at lower voltages. The inclusion of bus hold circuitry simplifies PCB layout by removing the need for external pull-up components on floating lines. Consider the TSSOP56 package dimensions if space constraints preclude the use of SSOP packages.

Part Context

This part belongs to the 74ALVT16501 family of universal bus transceivers. The DGG suffix specifically denotes the TSSOP56 plastic thin shrink small outline package with a body width of 6.1 mm. The manufacturer transitioned from NXP Semiconductors to Nexperia B.V. for this product line, though legacy documentation may retain NXP branding.

Replacement Considerations

The 74ALVT16501DL is a pin-compatible alternative available in the SSOP56 package (SOT371-1). Verify package dimensions and lead pitch differences between TSSOP and SSOP variants during replacement planning.