SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The Fairchild Semiconductor 74LVTH16374MTD is a low-voltage 16-bit D flip-flop featuring three-state outputs, designed for 3.3V VCC applications with TTL interface capability in 5V environments. It operates within a supply voltage range of 2.7V to 3.6V and supports a maximum propagation delay of 5.2 ns. The device provides high drive strength with output currents of -32 mA (high) and 64 mA (low). Packaged in a 48-TFSOP surface-mount format, it functions reliably across an operating temperature range of -40°C to +85°C.
Verify component authenticity through authorized distribution channels due to the prevalence of counterfeit logic ICs. Confirm that the specific suffix MTD corresponds to the 48-TFSOP package variant required for your PCB footprint. Ensure compliance with RoHS directives if lead-free assembly is mandated by your manufacturing standards. Cross-reference the manufacturer part number against current obsolescence notices to confirm production status before finalizing procurement plans.
Select this component when designing systems requiring 16-bit parallel data latching with high-speed performance at 3.3V logic levels. The TTL-compatible input structure simplifies interfacing with legacy 5V components without additional level shifting circuitry. Consider the 48-TFSOP package dimensions for space-constrained surface-mount designs requiring robust thermal performance and reliable electrical characteristics under varying load conditions.
This device belongs to the LVTH series of low-voltage logic products, bridging the gap between traditional 5V TTL logic and modern 3.3V CMOS technologies. The 74LVTH16374 variant specifically addresses the need for high-density data storage in portable and battery-operated devices where power efficiency is critical yet compatibility with existing 5V infrastructure must be maintained.
The 74LVTH16374MEAX serves as a verified substitute part number offering identical functional specifications and pinout configuration. Verify package compatibility when transitioning between TFSOP and SSOP variants to ensure mechanical fit within the target assembly.