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833-020-556-802 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE DUAL FMALE 20POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. model 833-020-556-802 is a standard card edge connector featuring 20 positions with a 3.96 mm pitch. Designed for dual-edge female contact interfaces, it utilizes gold-plated copper alloy terminals rated for 3 A current. The housing is constructed from diallyl phthalate (DAP) to support panel mount installation at vertical or right-angle orientations. It accommodates PCBs up to 1.57 mm in thickness and employs solder pin termination methods.
Verify component authenticity through authorized EDAC distributors or official manufacturer channels. Confirm that the specific suffix matches the required orientation and plating specifications. Ensure compliance with RoHS directives if applicable to your assembly requirements. Cross-reference the datasheet version to confirm insulation resistance and temperature ratings align with your design constraints before finalizing procurement orders.
Select this connector when a 20-position dual-edge interface is required for panel-mounted applications. The 3.96 mm pitch suits standard PCB layouts while the 3 A rating supports moderate power distribution. Consider the DAP housing material for environments requiring stable mechanical properties. Verify that the target PCB thickness falls within the 1.57 mm limit to ensure proper mating depth and contact engagement.
This component belongs to the EDAC 833 series of standard card edge connectors. The series offers various position counts and mounting angles to accommodate diverse electronic assembly needs. EDAC designs these connectors for durability in demanding sectors including medical and agricultural technologies. The 833 series emphasizes reliable performance through standardized dimensions and robust contact materials.
No public confirmed substitute part numbers are available in the provided documentation.
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