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837-025-500-608 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is 837 HIGH TEMP' SERIES (.156" (3.. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 837-025-500-608 is a high-temperature card edge connector from the 837 Series, designed for single-edge board applications. It features 25 positions with a 0.156" (3.96mm) contact spacing and utilizes gold-plated copper alloy contacts. The unit employs a female receptacle configuration with a green diallyl phthalate (DAP) insulator. Rated for operation between -40°C and 125°C, it supports PCB thicknesses of 0.054" to 0.070" and offers RoHS3 compliance.
Verify the specific suffix codes against official EDAC documentation to confirm exact termination style and mounting orientation. Ensure compatibility with target PCB thickness ranges before procurement. Confirm RoHS3 status requirements align with project specifications. Cross-reference ordering guides for accurate part identification.
Select this component for applications requiring robust performance in elevated temperature conditions. The 25-position count suits moderate-density interconnect needs. Verify that the single-edge board design matches the target circuit board geometry. Consider the 0.156-inch pitch when evaluating space constraints on the assembly.
This connector belongs to the EDAC 837 High Temp Series, engineered for reliability in harsh environments. The series offers various position counts and termination options. The 837-025 variant specifically addresses mid-range density requirements while maintaining high thermal resilience and consistent electrical performance standards.
Consult official EDAC substitution lists for verified alternatives. Generic equivalents may not match the specified high-temperature ratings or material composition. Verify dimensional compatibility and electrical characteristics before considering any substitute components.
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