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837-070-556-208 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE DUAL FMALE 70POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 837-070-556-208 is a standard card edge connector receptacle featuring 70 positions with a 3.96 mm (0.156 inch) contact spacing and 5.08 mm row spacing. Designed for through-hole mounting at a right angle, it accepts printed circuit boards with a nominal thickness of 1.57 mm (.062 inch). The contacts are gold-plated copper alloy, rated for 3 A current, while the housing is constructed from diallyl phthalate (DAP). This high-temperature series component utilizes wire wrap termination.
Verify the specific ordering suffix to confirm exact pin count, plating thickness, and termination type. Confirm that the 70-position variant matches the required board thickness of 1.57 mm. Check manufacturer documentation for RoHS compliance status and lead time requirements, as availability may vary by region.
Select this model when a 70-position dual-edge connector is required with 3.96 mm spacing. Ensure the application supports right-angle through-hole mounting and wire wrap termination. Verify that the operating temperature range exceeds standard levels due to the high-temperature series designation and DAP material composition.
This component belongs to the EDAC 837 High Temperature Series, designed for demanding environments. It is part of a broader family of standard card edge connectors offering various position counts and row configurations. The series emphasizes durability and thermal stability for critical interconnect applications.
Cross-reference with other 837-series variants such as 837-074-559-858 or 837-078-559-208 for similar form factors. Verify that substitute parts maintain the same 3.96 mm pitch, 70-position count, and right-angle through-hole mounting specifications.
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