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842-012-520-103 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE SINGLE FML 12POS 0.100. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 842-012-520-103 is a standard high-temperature card edge connector receptacle designed for through-hole mounting at a right angle. It features 12 positions with a contact spacing of 2.54 mm (0.100 inch) and a row spacing of 5.08 mm (0.200 inch). The connector accepts printed circuit boards with a nominal thickness of 1.57 mm (0.062 inch). Contacts are gold-plated to ensure reliable signal transmission in demanding environments.
Verify the specific ordering suffix against the official EDAC datasheet to confirm exact pin count, plating specifications, and mounting style. Ensure compatibility with the target PCB thickness of 1.57 mm. Confirm availability status as distribution channels may vary by region. Cross-reference the manufacturer part number with authorized distributor catalogs to validate authenticity and current production status before finalizing procurement orders.
Select this component when a right-angle, high-temperature card edge connector is required for 12-position applications. The 2.54 mm pitch ensures compatibility with standard board layouts. Verify that the through-hole mounting style aligns with the assembly process. Consider the high-profile insulator body design for adequate clearance. Confirm that the gold plating meets the environmental requirements for the intended application environment.
This part belongs to the EDAC 842 Series, which specializes in .100 inch (2.54mm) contact spacing card edge connectors. The series offers various configurations including different position counts and mounting styles. EDAC provides specialized interconnect solutions for medical and agricultural sectors, emphasizing durability and reliability in challenging operational settings.
Consult the official EDAC documentation for confirmed substitute part numbers within the same series. Verify that any alternative maintains identical mechanical dimensions, contact spacing, and temperature ratings. Ensure functional equivalence regarding board thickness acceptance and mounting orientation before substitution.
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