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846-023-559-104 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE SGL FMALE 23POS 0.125. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 846-023-559-104 is a standard card edge connector receptacle designed for high-temperature applications. It features 23 positions with a 3.175 mm pitch and accommodates a board thickness of 1.57 mm. The component utilizes gold-plated copper alloy contacts rated for 3 A current and employs PC pin termination for through-hole mounting. Constructed with diallyl phthalate (DAP) housing, it operates within a temperature range of -40°C to +125°C and maintains an insulation resistance of 5 GOhms.
Verify the specific suffix codes against the manufacturer's official datasheet to ensure exact dimensional and material compliance. Confirm availability status as distribution channels may indicate regional sales restrictions or non-stock conditions. Cross-reference the 23-position count and 3.175 mm pitch requirements with system design specifications before finalizing procurement orders.
Select this component when vertical mounting and through-hole PC pin termination are required for single-edge boards. Ensure the design accommodates the 1.57 mm board thickness constraint. Verify that the operating environment remains within the specified -40°C to +125°C range to maintain insulation integrity and contact performance standards defined by the DAP housing material.
This part belongs to the EDAC 846 series of standard card edge connectors. The series offers various position counts and mounting options. The 846-023-559-104 specifically addresses needs for 23-position vertical interconnects with high-temperature capabilities, distinguishing it from lower-temperature or different pitch variants within the broader product family.
No public confirmed substitute part numbers are available in the provided documentation. Direct replacement requires matching the 23-position count, 3.175 mm pitch, and vertical through-hole form factor precisely.
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