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857-033-545-101 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE SGL FMALE 33POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 857-033-545-101 is a standard card edge connector from the 857 series, designed for high-temperature applications. It features 33 positions with a 3.96 mm (0.156 inch) pitch and supports a board thickness of 1.57 mm. The component utilizes gold-plated copper alloy contacts and a polyphenylene sulfide (PPS) housing. Rated for 5 A current, it operates within a temperature range of -40°C to +125°C and offers an insulation resistance of 5 GOhms.
Verify the specific suffix '101' against official EDAC documentation to confirm exact plating thickness and flange configuration. Ensure compatibility with the target PCB edge thickness of 1.57 mm before procurement. Confirm that the panel mount orientation aligns with the mechanical design constraints of the final assembly enclosure.
Select this model when operating environments exceed standard thermal limits, as the PPS housing supports temperatures up to 125°C. The 33-position count and 3.96 mm pitch are fixed parameters; verify these match the circuit board layout requirements. Consider the vertical panel mount style if space constraints or cable routing necessitate a perpendicular connection interface relative to the mounting surface.
This component belongs to the EDAC 857 series, which specializes in high-temperature card edge connectors. The series is characterized by robust construction suitable for demanding industrial and commercial sectors. The 857 series provides various position counts and mounting options, ensuring flexibility for diverse electronic packaging needs while maintaining consistent electrical performance standards across the product line.
No public confirmed substitute part numbers are available in the provided documentation.
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