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895-012-544-808 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE DUAL FMALE 12POS 0.100. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 895-012-544-808 is a standard card edge connector from the 895 series, designed for vertical panel mount installation. It features a dual-edge female configuration with 12 positions and a 0.100-inch (2.54mm) pitch. The contacts are made of copper alloy with gold plating, suitable for non-specified dual-edge cards ranging from 0.054 to 0.070 inches in thickness. The housing is constructed from black polyphenylene sulfide (PPS), providing UL 94V-0 flammability rating.
Verify the specific ordering suffixes against the official EDAC 895 Series Ordering Guide to ensure correct termination style and mounting options. Confirm that the required card thickness falls within the specified 0.054 to 0.070 inch range. Check current availability status through authorized distributors as supply levels may vary. Ensure compliance with RoHS3 specifications if required by your project standards.
Select this component when a vertical, panel-mount solution is required for dual-edge circuit boards. The 12-position count and 2.54mm pitch define the interface density. Verify that the application environment does not exceed the thermal limits of the PPS material. Consider the gold plating for reliable signal transmission in low-power or sensitive signal paths.
This part belongs to the EDAC 895 series of standard card edge connectors. The series utilizes polyphenylene sulfide for the insulator, distinguishing it from other series like the 845 which uses diallyl phthalate. The 895 series offers various position counts and termination styles to accommodate different board designs and assembly requirements.
Consult the EDAC 895 Series Ordering Guide for direct substitutes with different position counts or termination types. Cross-reference with other EDAC series such as the 887 for high-temperature variants if environmental conditions require enhanced thermal performance.
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