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895-026-544-204 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE DUAL FMALE 26POS 0.100. Review the specifications below when checking this part for your BOM.
The EDAC Inc. part number 895-026-544-204 is a dual edge card edge connector designed for board-to-board or backplane interconnections. It features 26 positions with a contact spacing of 0.100 inches (2.54mm) and a row spacing of 0.200 inches (5.08mm). The connector utilizes gold-plated contacts and accepts printed circuit boards with a nominal thickness of 0.062 inches (1.57mm). It is characterized by a high-profile insulator body and black coloration, providing reliable signal transmission in standard density applications.
Verify the specific ordering suffix to confirm contact plating, insulation material, and mounting style match the design requirements. Ensure the PCB thickness tolerance aligns with the 0.062-inch specification. Confirm RoHS compliance status through official manufacturer documentation prior to procurement to meet regulatory standards.
Select this component when a dual-edge interface with 26 positions is required. The 0.100-inch pitch suits standard density layouts. Consider the high-profile body for adequate clearance. Verify that the application environment does not require specialized environmental sealing beyond standard industrial ratings.
This connector belongs to the EDAC 895 series of card edge connectors. The series offers various position counts and termination styles. The 895 model specifically denotes a dual-edge configuration suitable for applications requiring connection on both sides of the substrate. It is distinct from single-edge variants within the broader product line.
Direct substitutes include EDAC part numbers sharing the same 26-position count, 0.100-inch pitch, and dual-edge configuration. Cross-referencing datasheets for mechanical dimensions and contact plating specifications is essential to ensure functional equivalence without redesigning the PCB footprint.
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