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8T79S308NLGI8 is listed in the Clock Buffers, Drivers range at ChipApex. The manufacturer field lists Renesas Electronics Corporation. Its product description is IC CLK BUFFER 1:8 3GHZ 40VFQFPN. Review the specifications below when checking this part for your BOM.
The 8T79S308NLGI8 is a universal differential fanout buffer manufactured by Renesas Electronics. It provides a 1:8 output ratio, distributing a single differential input signal to eight differential outputs. The device supports LVDS and LVPECL input and output signaling standards. It operates at a maximum frequency of 3 GHz with supply voltage ranges of 1.71V to 1.89V, 2.375V to 2.625V, or 3.135V to 3.465V. Packaged in a 40-VFQFPN (6x6 mm) exposed pad format, it is designed for surface mount applications within an operating temperature range of -40°C to 105°C.
Verify the specific ordering suffix against official documentation to confirm package type and reel specifications. Confirm moisture sensitivity level requirements prior to assembly. Ensure the selected voltage supply mode aligns with the target application's power constraints. Check for RoHS compliance status through manufacturer datasheets before finalizing procurement plans.
Select this component when a high-frequency differential clock signal requires expansion into eight distinct paths. Ensure the system design accommodates the specified multi-range supply voltages. Verify that the 40-VFQFPN footprint matches the PCB layout constraints. Confirm thermal management capabilities are sufficient for the 105°C ambient operating temperature limit.
This part belongs to the Renesas clock buffer family, specifically designed for signal distribution tasks. It serves as a critical interface between source clocks and multiple downstream receivers in high-performance electronic systems. The device ensures signal integrity across various differential logic families.
Consult official Renesas cross-reference documents for verified substitutes. Ensure any replacement maintains the 1:8 ratio, 3 GHz frequency capability, and compatible VFQFPN package dimensions.
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