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Product Detailed Parameters
- Description：CAP SILICON 1000PF 15% 150V 0202
- Series：WBSC
- Mfr：Murata Electronics
- Package：Tape & Reel (TR),Cut Tape (CT)
- Capacitance：1000 pF
- Tolerance：±15%
- Voltage - Breakdown：150 V
- ESL (Equivalent Series Inductance)：50pH
- Applications：High Stability, Vertical Silicon Cap, Wirebond
- Features：High Reliability, Low Profile
- Operating Temperature：-55°C ~ 150°C
- Package / Case：0202 (0505 Metric)
- Height：0.011" (0.27mm)
- Size / Dimension：0.020" L x 0.020" W (0.50mm x 0.50mm)
- ESR (Equivalent Series Resistance)：50 mOhms
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Overview
The Murata Electronics 935142521410-T3T is a wire-bondable vertical silicon capacitor from the WBSC series. It features a capacitance of 1000 pF with a breakdown voltage of 150 V and a tolerance of ±15%. The component operates within a temperature range of -55°C to +150°C. It is housed in a 0202 (0505 Metric) package, measuring 0.011 inches (0.27 mm) in height. Equivalent series resistance is 50 mOhms, and equivalent series inductance is specified for high-frequency performance.
Feature Summary
- Wire-bondable vertical construction for direct integration
- Low profile design suitable for space-constrained applications
- High reliability characteristics for demanding environments
Applications
- RF high power applications
- High stability circuit requirements
- Vertical integration modules
Procurement Notes
Verify the specific ordering suffix and packaging configuration against the manufacturer's current documentation before procurement. Ensure that the wire-bondable termination style matches the target assembly process. Confirm that the 150 V breakdown rating and 1000 pF capacitance align with the circuit design specifications. Check for any recent updates to the datasheet regarding mechanical dimensions or thermal characteristics.
Selection Notes
Select this component when vertical mounting and wire bonding are required for RF circuits. The low profile and high-temperature capability make it suitable for compact, high-reliability designs. Consider the ±15% tolerance and 50 mOhm ESR for impedance matching. Evaluate the 0202 footprint against available board space. Compare against standard surface-mount capacitors if vertical integration offers a distinct advantage.
Part Context
This part belongs to Murata's WBSC series of wire-bondable silicon capacitors. These components are designed for high-frequency and high-power RF applications where traditional surface-mount packages may not meet spatial or electrical requirements. The silicon technology provides superior stability compared to ceramic alternatives in certain high-stress environments.
Replacement Considerations
No public confirmed substitute part numbers are available in the provided documentation. Direct replacement requires identical wire-bondable vertical architecture and matching electrical parameters.
