935156793522-T3N

Overview

The Murata Electronics 935156793522-T3N is a silicon capacitor from the ULSC series, designed for high stability applications. It features a capacitance of 0.022 µF and a breakdown voltage of 30 V. The component utilizes a 0201 (0603 Metric) surface mount package with dimensions of 0.8 mm in length and 0.1 mm in height. It operates within a temperature range of -55°C to 150°C and supports a maximum operating frequency of 20 GHz.

Feature Summary

• Ultra-broadband performance suitable for RF applications
• Thin film construction for low ESL characteristics
• High reliability design for stable operation

Applications

• RF circuits requiring high stability
• Broadband signal processing systems
• Optical communication interfaces

Procurement Notes

Verify the specific voltage rating requirements against the application needs, as some sources indicate a 3.8 V rating while others specify 30 V breakdown. Confirm the package dimensions match the PCB footprint constraints. Ensure the supplier provides official documentation to validate the part number and series classification before finalizing procurement orders.

Selection Notes

Select this component when ultra-broadband capabilities and low equivalent series inductance are critical for circuit performance. The small 0201 form factor makes it suitable for space-constrained designs. Consider the wide operating temperature range for environments subject to thermal extremes. Validate compatibility with high-frequency signal integrity requirements up to 20 GHz.

Part Context

This part belongs to the ULSC series of silicon capacitors manufactured by Murata Electronics. These components utilize thin-film technology to achieve superior electrical characteristics compared to traditional ceramic capacitors. The series is engineered for high-frequency applications where standard passive components may exhibit limitations in bandwidth or stability.

Replacement Considerations

Direct substitutes should be sought within the Murata ULSC series with matching capacitance and package size. Verify that alternative parts support similar frequency ranges and temperature specifications. Cross-reference pinout and dimensional tolerances to ensure mechanical compatibility without redesigning the PCB layout.