9DBL411BGLF

Overview

The 9DBL411BGLF is a four-output lower power differential fanout buffer manufactured by Renesas Electronics Corporation. Designed for Intel QPI and PCI Express (PCIe) applications, it accepts HCSL differential input signals and generates LP-HCSL differential outputs. The device operates at a maximum frequency of 150MHz with a single circuit configuration. It requires a supply voltage between 3V and 3.6V and functions within an industrial temperature range of 0°C to 70°C. The component is housed in a 20-TSSOP package with dimensions of 6.5 x 4.4 x 1.0 mm.

Feature Summary

• Four differential outputs with individual Output Enable (OE#) pins
• Supports Intel QPI and PCIe Gen1-2-3 standards
• Accepts spread spectrum input signals
• Typical power consumption of 132mW

Applications

• Intel QuickPath Interconnect (QPI)
• PCI Express (PCIe) Riser Cards
• NVMe Storage Systems
• Networking Accelerators

Procurement Notes

Verify the specific suffix 'GLF' against official Renesas documentation to confirm the exact package variant and lead-free status. Ensure compatibility with the 20-TSSOP footprint. Check current availability as distribution channels may report varying stock levels or standard packaging quantities.

Selection Notes

Select this component when a low-power solution for PCIe or QPI clock distribution is required. The 150MHz maximum frequency limits its use to Gen1 and Gen2 speeds. Compare with the BGILFT variant if an extended -40°C to 85°C operating temperature range is necessary for the design environment.

Part Context

This part belongs to the 9DBL411 family of fanout buffers. While the base model supports up to 150MHz, other variants like the 9DBL411AKLF offer higher frequencies up to 400MHz but are discontinued. The B-series variants specifically target Intel QPI and PCIe applications with standardized LP-HCSL output signaling.

Replacement Considerations

The 9DBL411BGILFT is a manufacturer-recommended alternative offering an extended temperature range (-40°C to 85°C). Verify pin-to-pin compatibility and thermal requirements before substitution.