9DBU0831AKLFT

Overview

The Renesas 9DBU0831AKLFT is an 8-output low-power clock buffer designed for PCIe Gen 1/2/3 and QPI/UPI applications. It features a single HCSL-compatible differential input and eight LP-HCSL differential outputs, operating within a frequency range of 33 MHz to 150 MHz. The device requires a 3.3 V supply voltage and consumes approximately 445 mW of typical power. Packaged in a space-saving 48-pin VFQFPN (6x6 mm) format, it supports spread spectrum inputs and includes hardware control via eight output enable pins.

Feature Summary

• Eight LP-HCSL differential outputs with fixed feedback path for zero-delay operation
• Supports PCIe Gen 1/2/3 and QPI/UPI standards with cycle-to-cycle jitter less than 50 ps
• Spread spectrum compatible input tracking for EMI reduction
• Hardware-controlled output enables for individual clock management

Applications

• PCI Express Gen 1, 2, and 3 system designs
• Intel QuickPath Interconnect (QPI) and Ultra Path Interconnect (UPI) architectures
• High-performance server and storage controller boards

Procurement Notes

Verify the suffix 'AKLFT' confirms the specific tape-and-reel packaging and lead-free composition. Confirm moisture sensitivity level (MSL) ratings and reflow soldering profiles against current datasheet revisions before procurement planning.

Selection Notes

Select this component when interfacing with PCIe or QPI/UPI sources requiring low-power distribution. Ensure the design accommodates the 3.3 V supply requirement and the 48-pin VFQFPN footprint. Compare against the 9ZXL0831 series if lower power consumption is critical, noting the trade-off in performance specifications.

Part Context

This part belongs to the IDT/Renesas ultra-low-power PCIe clock buffer family. It serves as a fanout buffer to distribute reference clocks to multiple downstream components while maintaining signal integrity and minimizing power dissipation in high-density electronic systems.

Replacement Considerations

The 9ZXL0831E is noted as a pin-to-pin alternative with improved performance and reduced external components. Verify electrical compatibility and package dimensions before substitution.