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A1P35S12M3-F is listed in the IGBT Modules range at ChipApex. The manufacturer field lists STMicroelectronics. Its product description is IGBT MOD 1200V 35A 250W ACEPACK1. Review the specifications below when checking this part for your BOM.
IGBT Modules specifications for A1P35S12M3-F
- Description：IGBT MOD 1200V 35A 250W ACEPACK1
- Series：-
- Mfr：STMicroelectronics
- Package：Tray
- IGBT Type：Trench Field Stop
- Configuration：Three Phase Inverter
- Vce(on) (Max) @ Vge, Ic：2.45V @ 15V, 35A
- Input：Standard
- NTC Thermistor：Yes
- Operating Temperature：-40°C ~ 150°C (TJ)
- Mounting Type：Chassis Mount
- Package / Case：Module
- Supplier Device Package：ACEPACK™ 1
- Voltage - Collector Emitter Breakdown (Max)：1200 V
- Current - Collector (Ic) (Max)：35 A
- Power - Max：250 W
- Current - Collector Cutoff (Max)：100 µA
- Input Capacitance (Cies) @ Vce：2.154 nF @ 25 V
IGBT Modules datasheet and documents for A1P35S12M3-F
IGBT Modules Overview
The A1P35S12M3-F is a sixpack IGBT power module in the ACEPACK™ 1 package, integrating trench gate field-stop technology. It features 1200 V collector-emitter voltage and 35 A continuous collector current at TC = 100 °C. The module includes soft recovery diodes with a forward voltage of 2.95 V (typical) at IF = 35 A. An integrated NTC thermistor provides thermal monitoring with a resistance of 5 kΩ at 25 °C. Press-fit contact pins facilitate mounting. The device supports junction temperatures up to 175 °C and operates between -40 °C and 150 °C under switching conditions.
IGBT Modules Feature Summary
- Sixpack topology with trench gate field-stop IGBTs and soft recovery diodes
- Integrated NTC temperature sensor for thermal management
- Press-fit contact pins for secure mechanical connection
- DBC Cu Al2O3 Cu substrate construction
IGBT Modules Applications
- Inverters
- Industrial applications
- Motor drives
IGBT Modules Procurement Notes
Verify component authenticity through authorized STMicroelectronics distributors or official sales channels. Confirm datasheet revision DS11636 Rev 5 matches the delivered product marking. Ensure handling procedures comply with ESD protection standards during installation. Validate that press-fit tooling specifications align with ACEPACK™ 1 mechanical requirements before assembly.
IGBT Modules Selection Notes
Select this module for systems requiring 1200 V blocking capability and 35 A current handling within a compact footprint. Consider the 175 °C maximum junction temperature for high-thermal-stress environments. Evaluate gate resistance values against switching energy curves to optimize efficiency. Verify heatsink compatibility with the specified thermal resistance parameters for reliable operation.
IGBT Modules Part Context
This component belongs to the ACEPACK™ 1 family of power modules from STMicroelectronics. It utilizes advanced trench gate field-stop IGBT technology designed to balance conduction and switching losses. The series targets high-efficiency converter systems operating up to 20 kHz. The packaging integrates electrical isolation and thermal management features suitable for industrial and automotive-grade applications.
IGBT Modules Replacement Considerations
Direct substitutes include A1P25S12M3-F and A1P35S12M3. Verify pinout compatibility and thermal characteristics when replacing components. Ensure replacement parts meet the same voltage and current ratings for system integrity.
Explore related parts through IGBTs, Transistors, Discrete Semiconductor Products, all product categories.
