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A1P50S65M2 is listed in the IGBT Modules range at ChipApex. The manufacturer field lists STMicroelectronics. Its product description is IGBT MOD 650V 50A 208W ACEPACK1. Review the specifications below when checking this part for your BOM.
The A1P50S65M2 is an IGBT power module from STMicroelectronics, utilizing the ACEPACK™ 1 package with a Sixpack topology. It integrates trench gate field-stop IGBT M series technology and soft recovery diodes rated at 650 V and 50 A. The device features an integrated NTC thermistor for thermal monitoring. Key electrical parameters include a collector-emitter saturation voltage of 1.95 V at 25°C, a maximum operating temperature of +150°C, and a power dissipation capacity of 208 W. The module employs a DBC Cu Al2O3 Cu substrate and is designed for efficient operation in converter systems up to 20 kHz.
Verify component authenticity through authorized STMicroelectronics distributors or official channels. Confirm the specific revision level matches design requirements. Ensure proper handling procedures are followed due to the sensitivity of semiconductor components. Cross-reference datasheet specifications against current application constraints before finalizing procurement decisions.
Select this module for applications requiring high efficiency in power conversion up to 20 kHz. The integrated NTC facilitates accurate thermal modeling using tools like STPOWER Studio. Consider the 208 W power dissipation rating when designing heat sink solutions. Verify that the 650 V blocking voltage aligns with the system's peak voltage stresses.
This component belongs to the ACEPACK™ 1 family of plastic power modules designed for industrial and power management solutions. It represents STMicroelectronics' commitment to compact, high-performance designs that support Industry 4.0 initiatives by improving energy efficiency in automated machinery and smart factory environments.
Consult official STMicroelectronics documentation for qualified replacement part numbers. Ensure any substitute maintains compatible pinout, voltage ratings, and thermal characteristics. Verify that alternative devices offer equivalent switching performance and packaging dimensions for direct integration.
Explore related parts through IGBTs, Transistors, Discrete Semiconductor Products, all product categories.