A2F200M3F-1FG256I

Soc System On Chip Overview

The A2F200M3F-1FG256I is a SmartFusion2 System-on-Chip FPGA manufactured by Microchip Technology. It integrates a hard ARM Cortex-M3 processor with flash-based FPGA fabric in a 256-pin FBGA package. Key electrical parameters include an operating voltage range of 1.14 V to 1.26 V for the core and 1.425 V to 1.575 V for I/Os. The device supports industrial temperatures from -40°C to +85°C and features up to 200,000 gates, 4608 configurable logic blocks, and embedded memory including eNVM and eSRAM.

Soc System On Chip Feature Summary

• Integrates a hard 100 MHz 32-bit ARM Cortex-M3 processor with MPU and hardware divide
• Flash-based FPGA fabric providing non-volatile configuration and up to 200K system gates
• Includes 10/100 Ethernet MAC, USB 2.0 OTG, and multiple communication peripherals
• Supports high-speed interfaces including DDR3/DDR3L and PCIe Gen1 x1

Soc System On Chip Applications

• Industrial automation and control systems requiring deterministic real-time processing
• Automotive infotainment and body electronics with safety-critical requirements
• Aerospace and defense avionics utilizing radiation-tolerant or high-reliability components
• Medical imaging equipment and diagnostic devices needing secure data handling

Soc System On Chip Procurement Notes

Verify RoHS compliance status as specific suffixes may vary. Confirm moisture sensitivity level (MSL) and reflow soldering profile requirements prior to assembly. Check for export control classifications such as ECCN if shipping internationally. Ensure supply chain authenticity through authorized distributors to avoid counterfeits.

Soc System On Chip Selection Notes

Select this model when both programmable logic flexibility and embedded processor control are required in a single die. Compare gate counts and memory sizes against higher-end M3B variants if more performance is needed. Verify pin compatibility with existing PCB footprints, as the FG256 package has specific I/O assignments.

Soc System On Chip Part Context

This component belongs to the SmartFusion2 family, bridging the gap between traditional MCUs and FPGAs. It succeeds earlier ProASIC3 and IGloo families by adding a hardened processor subsystem. The part is designed for applications demanding low power, security, and mixed-signal capabilities in a compact form factor.

Soc System On Chip Replacement Considerations

Direct pin-to-pin replacements within the same package are limited to other SmartFusion2 parts with equal or lower resource counts. Cross-family migration to PolarFire or IGloo2 requires schematic redesign due to architectural differences. Always validate timing closure and peripheral availability when substituting.