Field Programmable Gate Array A3P1000-FGG256T product image

A3P1000-FGG256T

  • Description:IC FPGA 177 I/O 256FBGA
  • Series:ProASIC3

SKU:2327d34092d1 Category: Brand:

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A3P1000-FGG256T is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is IC FPGA 177 I/O 256FBGA. Review the specifications below when checking this part for your BOM.

Field Programmable Gate Array specifications for A3P1000-FGG256T

  • Description:IC FPGA 177 I/O 256FBGA
  • Series:ProASIC3
  • Mfr:Microchip Technology
  • Package:Tray
  • Total RAM Bits:147456
  • Number of I/O:177
  • Voltage - Supply:1.425V ~ 1.575V
  • Mounting Type:Surface Mount
  • Operating Temperature:-40°C ~ 125°C (TA)
  • Package / Case:256-LBGA
  • Supplier Device Package:256-FPBGA (17x17)
  • Number of Gates:1000000
  • Grade:Automotive
  • Qualification:AEC-Q100

Field Programmable Gate Array datasheet and documents for A3P1000-FGG256T

A3P1000-FGG256T

Field Programmable Gate Array Overview

The A3P1000-FGG256T is a Field Programmable Gate Array from the ProASIC3 Flash family, manufactured by Microchip Technology. It features 1,000,000 system gates and 24,576 Configurable Logic Blocks (CLBs). The device supports a maximum system frequency of 350 MHz and includes up to 144 Kbits of True Dual-Port SRAM. It offers up to 300 user I/Os with mixed-voltage support for 1.5 V, 1.8 V, 2.5 V, and 3.3 V standards. The component is housed in a 256-pin FineLine BGA package.

Field Programmable Gate Array Feature Summary

  • Nonvolatile flash-based architecture enabling instant-on operation without external configuration memory.
  • Supports high-speed DDR interfaces and LVDS-capable I/Os for advanced signal integrity.
  • Includes integrated Clock Control Center blocks with phase-shift and multiply/divide capabilities.
  • Allows in-system programming via standard PCI interfaces for field updates.

Field Programmable Gate Array Applications

  • High-density digital logic prototyping and emulation
  • Industrial control systems requiring nonvolatile reconfiguration
  • Telecommunications infrastructure using LVDS signaling
  • Automotive electronics with mixed-voltage I/O requirements

Field Programmable Gate Array Procurement Notes

Verify the specific suffix 'T' against official Microchip documentation to confirm tape-and-reel packaging status, as generic part numbers may imply tray packaging. Ensure the voltage grade matches application needs, as the base model covers industrial temperature ranges. Cross-reference the exact datasheet revision DS0097 for current pinout and electrical specifications before finalizing orders.

Field Programmable Gate Array Selection Notes

Select this model for designs requiring large logic capacity with immediate power-up functionality. Compare against the A3P1000-1FGG256 variant if higher speed grades are unnecessary. Consider the M1A3P1000 series if embedded ARM processing is required alongside FPGA fabric. Verify that the 256-pin FBGA footprint fits the target PCB layout constraints.

Field Programmable Gate Array Part Context

This component belongs to the ProASIC3 Flash family, which bridges the gap between ASICs and traditional SRAM-based FPGAs. Unlike volatile counterparts, it retains configuration data when powered off. The family emphasizes low power consumption and high reliability, making it suitable for space-constrained and mission-critical applications where instant availability is essential.

Field Programmable Gate Array Replacement Considerations

Publicly confirmed substitutes include the A3P1000-1FGG256 for lower speed grades or the A3P1000-2FGG256M for different performance tiers. The A3P1000L-1FG256 serves as a low-power alternative within the same package. Verify pin compatibility across these variants before substitution.

A3P1000-FGG256TA3P1000-FGG256T

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