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A3P125-1PQG208 is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is IC FPGA 133 I/O 208QFP. Review the specifications below when checking this part for your BOM.
The A3P125-1PQG208 is a ProASIC3 Field Programmable Gate Array manufactured by Microchip Technology. It features 125,000 logic gates and supports up to 154 I/O pins within a 208-pin PQFP package. The device operates on a single 1.5V supply voltage, ranging from 1.425V to 1.575V. It includes embedded memory resources totaling 110,592 bits. The component is rated for an industrial temperature range of -40°C to +85°C and supports maximum operating frequencies up to 272 MHz.
Verify the specific suffix '1' indicates the speed grade and 'PQG208' denotes the plastic quad flatpack package variant. Confirm RoHS compliance status through official Microchip documentation prior to integration. Ensure ESD handling protocols are followed during assembly due to moisture sensitivity classification. Cross-reference with current production lifecycle status to avoid obsolescence risks in long-term designs.
Select this model when a mid-range gate count with significant I/O density is required in a standard QFP footprint. Compare against the A3P125-1FGG144I if a smaller ball grid array package is preferred for space-constrained boards. Consider the M1A3P250 series if higher logic capacity or military-grade temperature ratings are necessary for the application environment.
This component belongs to the ProASIC3 family, which bridges the gap between complex FPGAs and simple PLDs. It offers the flexibility of programmable logic with the system-level integration benefits of ASICs. The family is designed for applications needing rapid time-to-market with low initial NRE costs compared to custom silicon solutions.
Direct pin-compatible replacements within the same package may include other ProASIC3 variants with matching I/O counts. Verify electrical specifications carefully when substituting with higher-density parts like the A3P250 series, as power and thermal characteristics will differ significantly.
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