A3P250L-1FGG256I

Field Programmable Gate Array Overview

The A3P250L-1FGG256I is a ProASIC3L Field Programmable Gate Array manufactured by Microsemi Corporation. It features 250,000 system gates and 36,864 bits of embedded SRAM within a 256-pin FineLine BGA package. The device supports a core voltage range of 1.14V to 1.575V and operates at temperatures from -40°C to 100°C. Key specifications include 151 user I/Os, a maximum system frequency of 350 MHz, and support for mixed-voltage I/O standards including LVCMOS 3.3V/2.5V/1.8V/1.5V.

Field Programmable Gate Array Feature Summary

• Flash-based non-volatile technology enabling instant power-up operation without external configuration memory
• Low-power architecture utilizing a dedicated low-voltage core supply for reduced energy consumption
• Advanced I/O capabilities supporting mixed-voltage banks and high-speed differential signaling standards

Field Programmable Gate Array Applications

• Industrial control systems requiring deterministic boot times
• Telecommunications infrastructure with mixed-voltage interface requirements
• Automotive electronics operating in extended temperature environments

Field Programmable Gate Array Procurement Notes

Verify the specific suffix 'I' indicates industrial temperature rating compliance during sourcing. Confirm RoHS status as some ProASIC3L variants may have different environmental certifications. Ensure the 256-pin FBGA footprint matches the target PCB design constraints before procurement.

Field Programmable Gate Array Selection Notes

Select this component when non-volatile flash technology is required to eliminate external configuration devices. Compare against the standard A3P250 series if lower cost is prioritized over extended temperature ranges. Verify that the 151 available I/Os meet the interface density requirements for the specific application design.

Field Programmable Gate Array Part Context

This part belongs to the ProASIC3L family, which offers lower power consumption compared to the standard ProASIC3 series. It shares pin compatibility with other devices in the family, facilitating design scalability across different capacity tiers while maintaining the same physical package dimensions.

Field Programmable Gate Array Replacement Considerations

Direct replacements include the A3P250-1FGG256I for standard temperature applications or the A3P025-1FGG256I for lower gate count needs. Cross-family migration to SmartFusion or IGLOO may be necessary for advanced processing integration.