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A3P400-FG484 is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists Microsemi Corporation. Its product description is IC FPGA 194 I/O 484FBGA. Review the specifications below when checking this part for your BOM.
The A3P400-FG484I is a ProASIC3 Flash Field Programmable Gate Array manufactured by Microsemi. It features 400,000 system gates and 9,216 configurable logic blocks (VersaTiles). The device operates within an industrial temperature range of -40°C to +100°C and utilizes a Fine Pitch Ball Grid Array package with 484 pins. Key specifications include a maximum clock frequency of 350 MHz, support for up to 194 user I/Os, and embedded memory comprising 54 kbits of SRAM and 1 kbit of nonvolatile FlashROM.
Verify the specific suffix 'I' confirms the industrial temperature rating (-40°C to +100°C) as defined in the ordering information. Confirm that the FG484 package designation matches the required footprint dimensions and pin pitch. Ensure design tools support the ProASIC3 Flash family for successful implementation.
Select this device for designs requiring 400,000 system gates with nonvolatile storage. Compare against A3P250 or A3P600 if gate density requirements differ. Verify that the 484-pin FBGA package fits the board space constraints. Check if ARM Cortex-M1 integration is needed, which requires the M1A3P400 variant.
This component belongs to the ProASIC3 Flash family, representing third-generation flash FPGA technology from Microsemi. It bridges the gap between CPLDs and complex FPGAs, offering ASIC-level costs with FPGA reprogrammability. The family emphasizes low power consumption and robust security features compared to traditional SRAM-based FPGAs.
Publicly confirmed substitutes include other devices within the ProASIC3 Flash family such as the A3P250 or A3P600, provided pin compatibility and density requirements are met. Migration should consult the ProASIC3 FPGA Fabric User Guide for design compliance.
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