Field Programmable Gate Array A3P600-FGG256I product image

A3P600-FGG256I

$55.86
  • Description:IC FPGA 177 I/O 256FBGA
  • Series:ProASIC3

SKU:91c672224367 Category: Brand:

  
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A3P600-FGG256I is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is IC FPGA 177 I/O 256FBGA. Review the specifications below when checking this part for your BOM.

Field Programmable Gate Array specifications for A3P600-FGG256I

  • Description:IC FPGA 177 I/O 256FBGA
  • Series:ProASIC3
  • Mfr:Microchip Technology
  • Package:Tray
  • Total RAM Bits:110592
  • Number of I/O:177
  • Voltage - Supply:1.425V ~ 1.575V
  • Mounting Type:Surface Mount
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Package / Case:256-LBGA
  • Supplier Device Package:256-FPBGA (17x17)
  • Number of Gates:600000
  • Grade:-
  • Qualification:-

Field Programmable Gate Array datasheet and documents for A3P600-FGG256I

A3P600-FGG256I

Field Programmable Gate Array Overview

The A3P600-FGG256I is a Flash-based Field Programmable Gate Array from the ProASIC3 family, manufactured by Microchip Technology. It features 600,000 system gates and 13,824 configurable logic blocks (CLBs). The device supports a maximum clock frequency of 350 MHz and includes up to 144 kbits of True Dual-Port SRAM. It offers up to 300 user I/Os with mixed-voltage support for 1.5 V, 1.8 V, 2.5 V, and 3.3 V operation. Housed in a 256-pin FBGA package measuring 17 x 17 mm, it operates within a temperature range of -40°C to +100°C.

Field Programmable Gate Array Feature Summary

  • Flash-based non-volatile architecture enabling live-at-power-up functionality without external configuration memory.
  • Supports in-system programming and secure design protection using on-chip encryption capabilities.
  • Features advanced I/O standards including LVDS-capable interfaces and hot-swappable I/O support.

Field Programmable Gate Array Applications

  • High-performance digital signal processing systems requiring low power consumption.
  • Industrial automation controllers utilizing mixed-voltage I/O standards.
  • Secure communication infrastructure leveraging built-in encryption features.

Field Programmable Gate Array Procurement Notes

Verify component authenticity through authorized Microchip distributors or direct manufacturer channels. Confirm RoHS compliance status as historical data indicates variations across production batches. Ensure proper handling procedures are followed due to moisture sensitivity classification level 3 requirements during storage and reflow soldering processes.

Field Programmable Gate Array Selection Notes

Select this model when non-volatile flash technology is required to eliminate external configuration devices. Consider the 350 MHz performance limit and 13,824 CLB capacity for complex logic implementations. Evaluate mixed-voltage I/O needs against available bank configurations. Compare resource availability with higher-density ProASIC3 variants if additional logic capacity is anticipated.

Field Programmable Gate Array Part Context

This component belongs to the ProASIC3 Flash FPGA family, representing a mid-range density solution within Microchip's programmable logic portfolio. It bridges the gap between standard ASICs and larger FPGAs, offering reprogrammability with flash reliability. The FBGA-256 package provides a compact footprint suitable for space-constrained embedded applications requiring robust field-upgrade capabilities.

Field Programmable Gate Array Replacement Considerations

Direct pin-compatible replacements within the ProASIC3 family include the A3P600L variant for lower voltage operations. For upgraded performance, consider the A3PE600 series which utilizes eFlash technology. Verify that any substitute maintains the required 256-pin FBGA form factor and matches the specific speed grade and temperature rating specifications.

A3P600-FGG256IA3P600-FGG256I
$55.86
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