A3P600L-1FG256

Field Programmable Gate Array Overview

The A3P600L-1FG256 is a ProASIC3 Flash Field Programmable Gate Array manufactured by Microsemi. It features 13,824 configurable logic blocks and 600,000 system gates within a 256-pin FBGA package. The device operates at a maximum clock frequency of 250 MHz with a supply voltage range of 1.14 V to 1.26 V. It supports an industrial temperature range from -40°C to +85°C and includes up to 144 kbits of embedded SRAM.

Field Programmable Gate Array Feature Summary

• Flash-based non-volatile architecture enabling live-at-power-up functionality without external configuration memory
• Low-power design utilizing 130-nm CMOS process technology for reduced energy consumption
• Supports mixed-voltage I/O standards including LVDS, LVTTL, and LVCMOS across multiple banks

Field Programmable Gate Array Applications

• Industrial control systems requiring deterministic boot times
• Telecommunications infrastructure equipment
• Aerospace and defense avionics applications

Field Programmable Gate Array Procurement Notes

Verify the specific suffix '1' indicates the industrial temperature grade (-40°C to +85°C) and speed bin. Confirm RoHS compliance status as legacy ProASIC3 devices may have varying environmental declarations. Check for active manufacturing or obsolescence notices directly from Microchip before finalizing procurement plans.

Field Programmable Gate Array Selection Notes

Select this component when non-volatile flash configuration is required to eliminate external PROMs. Ensure the 250 MHz performance meets timing constraints. Compare against the standard A3P600 if commercial temperature range suffices, or consider higher-capacity models like A3P1000 for increased logic density requirements.

Field Programmable Gate Array Part Context

This part belongs to the ProASIC3 Flash family, bridging the gap between ASIC costs and FPGA flexibility. It utilizes Microsemi's proprietary flash process, offering radiation tolerance and security features inherent to non-volatile logic. The FG256 package provides a compact footprint for high-density designs.

Field Programmable Gate Array Replacement Considerations

Direct pin-compatible replacements include other members of the ProASIC3 Flash family such as the A3P250 or A3P500, provided gate counts are sufficient. Verify that any substitute maintains the same FBGA-256 footprint and electrical characteristics.