A5ED052BB23AE5S

Soc System On Chip Overview

The Altera A5ED052BB23AE5S is an Agilex 5 E-Series System on Chip (SoC) FPGA. It integrates a second-generation Hyperflex FPGA fabric with an embedded ARM processor subsystem. The device features dual-core ARM Cortex-A76 and dual-core ARM Cortex-A55 MPCore processors equipped with CoreSight debug interfaces. Key technical specifications include a logic element count of 52K, integrated RAM size of 512kB, and support for high-speed peripherals including DDR, DMA, PCIe, and WDT. The component operates within a temperature range of 0°C to 100°C TJ and utilizes a 839-VPBGA package.

Soc System On Chip Feature Summary

• Agilex 5 E-Series architecture with 52K logic elements
• Dual-core ARM Cortex-A76 and dual-core ARM Cortex-A55 MPCore HPS
• Integrated 512kB RAM and advanced connectivity (PCIe, DDR, Ethernet)
• 839-VPBGA package with 264 I/Os

Soc System On Chip Applications

• Edge AI acceleration using FPGA AI Suite
• Industrial automation controllers
• Network infrastructure equipment
• Embedded sensor processing systems

Soc System On Chip Procurement Notes

Verify the exact suffix 'AE5S' against official Intel/Altera documentation to confirm speed grade and commercial temperature rating. Confirm moisture sensitivity level (MSL 3) and shelf-life constraints prior to assembly. Ensure compatibility with Agilex 5 design tools and IP libraries.

Soc System On Chip Selection Notes

Select this model for applications requiring asymmetric multi-processing with high-performance Cortex-A76 cores alongside energy-efficient Cortex-A55 cores. Compare logic density against the 50KLE and 85KLE variants in the Agilex 5E family to ensure optimal resource utilization. Verify package pinout compatibility with existing board designs.

Soc System On Chip Part Context

This part belongs to the Agilex 5 E-Series, designed for power-efficient edge computing. It offers 1.6x better performance-per-watt compared to competing 16nm node FPGAs. The series emphasizes scalability from 50KLE to higher densities while maintaining robust security features via the Secure Device Manager.

Soc System On Chip Replacement Considerations

Direct substitutes within the same package and functionality are limited due to specific speed binning. Consider Agilex 5E variants with matching 839-VPBGA footprints if logic density allows. Validate pin-to-pin compatibility and thermal requirements before substitution.