ACDSV6-4448TI-G

Overview

The ACDSV6-4448TI-G is a general-purpose diode array manufactured by Comchip Technology. It features three independent diodes configured in a surface-mount package. The device supports a maximum DC reverse voltage of 80 V and an average rectified current of 100 mA per diode. Key electrical characteristics include a forward voltage of 1 V at 100 mA, a reverse leakage current of 100 nA at 75 V, and a reverse recovery time of 4 ns.

Feature Summary

• Contains three independent diode channels within a single compact component
• Engineered for small signal applications with rapid switching capabilities
• Utilizes standard silicon technology for reliable general-purpose rectification

Applications

• General purpose rectification circuits
• Small signal processing systems
• Surface mount assembly designs requiring multiple diode functions

Procurement Notes

Verify the specific ordering suffix to confirm packaging configuration, as options include Tape & Reel, Cut Tape, and Digi-Reel. Confirm the active part status directly with the manufacturer or authorized distributors before finalizing procurement plans. Ensure the selected variant matches the required reel quantity or cut tape specifications for the intended production line.

Selection Notes

Select this component when a design requires three isolated diode paths in a minimal footprint. The 80 V reverse voltage rating suits low-voltage logic and signal conditioning environments. The 4 ns reverse recovery time makes it suitable for high-speed switching applications where standard diodes may introduce excessive delay or noise.

Part Context

This part belongs to the discrete semiconductor product category under diodes and rectifiers. Specifically, it is classified as a diode array designed for surface mount technology. The SOT-363 package provides a space-efficient solution for modern electronic assemblies compared to through-hole alternatives.

Replacement Considerations

Cross-reference with other 80 V, 100 mA diode arrays in the SOT-363 package. Verify pinout compatibility and reverse recovery time specifications to ensure functional equivalence in existing circuit layouts.