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The ACPL-T350-060E is a single-channel logic output optocoupler designed for IGBT gate drive applications. It integrates a GaAsP LED optically coupled to an integrated circuit with a power output stage. Key electrical parameters include a rise time of 15 ns and a fall time of 20 ns. The device supports a maximum forward current of 16 mA with a forward voltage of 1.5 V and a reverse voltage rating of 5 V. It offers an insulation voltage of 3750 Vrms and operates within a temperature range of -40°C to +100°C. Power dissipation is rated at 295 mW, and it is available in an 8-DIP through-hole package.
Verify the specific suffix (060E) corresponds to the 8-DIP through-hole package variant. Confirm RoHS compliance status as indicated by the 'E' suffix. Ensure the procurement channel provides valid datasheets from Broadcom Limited or Avago. Check for any regional shipping restrictions associated with the distributor. Validate that the component matches the required 3750 Vrms isolation rating for the intended safety application.
Select this component when a single-channel isolated gate driver with 3750 Vrms isolation is required. It is suitable for driving IGBTs where moderate speed and 2.5A peak current are sufficient. Consider the DIP-8 package if through-hole mounting is necessary. Compare against surface-mount variants like the ACPL-T350-560E if PCB space constraints dictate SMD usage. Ensure the input current limits align with the driving logic levels.
This part belongs to the ACPL-T350 family of gate drive optocouplers manufactured by Broadcom Limited. The family includes various packaging options such as DIP and SOIC. These devices are engineered to provide robust isolation between control circuits and high-power switching elements. The T350 series is widely used in industrial automation and power conversion equipment requiring reliable signal transmission across potential differences.
The ACPL-T350-360E is a related variant but is listed as obsolete. The ACPL-T350-560E serves as a surface-mount alternative with similar functional characteristics but differs in package type (SMD-8 vs. DIP-8). Verify pin compatibility and thermal performance when substituting.