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Product Detailed Parameters
- Description:IC OPAMP GP 4 CIRCUIT DIE
- Series:-
- Mfr:Analog Devices Inc.
- Package:Bulk
- Amplifier Type:General Purpose
- Number of Circuits:4
- Output Type:Rail-to-Rail
- Slew Rate:5V/µs
- Gain Bandwidth Product:10 MHz
- Current - Input Bias:1 pA
- Voltage - Input Offset:400 µV
- Current - Supply:950µA (x4 Channels)
- Current - Output / Channel:80 mA
- Voltage - Supply Span (Min):2.7 V
- Voltage - Supply Span (Max):6 V
- Operating Temperature:-40°C ~ 125°C
- Grade:-
- Mounting Type:Surface Mount
- Package / Case:Die
- Supplier Device Package:Die
- -3db Bandwidth:-
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Overview
The AD8694WAC-P7 is a quad rail-to-rail output operational amplifier die from Analog Devices Inc., qualified for automotive applications. It operates on a single supply voltage ranging from 2.7 V to 6 V and functions within an extended industrial temperature range of -40°C to +125°C. The device features a gain bandwidth product of 10 MHz, a slew rate of 5 V/µs, and a typical input offset voltage of 400 µV with a maximum drift of 6 µV/°C. Supply current per amplifier is typically 0.95 mA.
Feature Summary
- Automotive-qualified CMOS technology providing low noise and wide signal bandwidth
- Rail-to-rail output capability ensuring full dynamic range operation
- Very low input bias currents suitable for high impedance sensor interfaces
Applications
- Photodiode amplification circuits
- Battery-powered instrumentation systems
- Medical instruments requiring precision signal conditioning
- Multipole filters and integrators
- Portable audio devices
Procurement Notes
Verify the specific wafer fab site and lot traceability required for your automotive quality standards before procurement. Confirm that the bare die form factor aligns with your packaging capabilities and assembly processes. Ensure ESD handling protocols are strictly followed during integration. Review the latest datasheet revision for any updates to electrical characteristics or ordering information.
Selection Notes
Select this component when automotive qualification is mandatory alongside low noise performance. The quad configuration reduces board space compared to single or dual packages. Consider the bare die format if custom packaging or flip-chip bonding is utilized in the final design. Verify thermal management requirements as the junction temperature rating extends to +150°C.
Part Context
This part belongs to the AD8691/AD8692/AD8694 family of low cost, low noise, CMOS, rail-to-rail output operational amplifiers. The 'W' suffix indicates automotive qualification, while 'AC' denotes the specific die variant. The '-P7' suffix identifies the package option as a bare die intended for advanced packaging solutions rather than standard surface-mount components.
Replacement Considerations
The commercial equivalent is the AD8694ARUZ die. Other family members include the AD8691AUJZ-R2 and AD8692ARMZ-R7.
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