ADP5585ACPZ-01-R7

Overview

The ADP5585ACPZ-01-R7 is a keypad decoder and I/O expander from Analog Devices, housed in a 16-lead LFCSP package. It features 10 configurable I/Os supporting up to a 5x5 matrix, with the ADP5585ACxZ-01-R7 variant adding an 11th GPIO for a 6x5 matrix. Operating on a 1.8 V to 3.3 V supply, it includes a 16-element FIFO for event recording, programmable logic blocks, PWM generation, and reset generators. The device communicates via an I2C interface with Fast Mode Plus support up to 1 MHz.

Feature Summary

• Integrated 16-element FIFO for efficient event recording and processor offloading
• Configurable I/O structure supporting keypad decoding, general-purpose input/output, and logic functions
• Built-in programmable logic block, PWM generator, and dual reset generators

Applications

• Keypad entries and input/output expansion capabilities
• Smart phones, remote controls, and cameras
• Healthcare, industrial, and instrumentation systems

Procurement Notes

Verify the specific ordering suffix -01-R7 to confirm the inclusion of the additional Row 5 GPIO function. Ensure the LFCSP-16 package type matches your PCB footprint requirements. Confirm that the I2C address and voltage levels align with your system design before finalizing procurement.

Selection Notes

Select this model when a 6-row by 5-column keypad matrix is required, as the -01 suffix enables the RST pin as an extra row. Compare against the -00 variant if only a standard 5x5 matrix is needed. Consider the WLCSP package option if board space is more constrained than the LFCSP allows.

Part Context

This component belongs to the ADP5585 series of I/O expanders designed for portable and non-portable applications. It integrates keypad scanning, GPIO expansion, and programmable logic into a single chip to reduce system complexity and power consumption.

Replacement Considerations

The ADP5585ACBZ-01-R7 offers identical functionality but uses a 16-ball WLCSP package instead of the LFCSP-16. Verify package compatibility and thermal dissipation requirements when substituting between these two form factors.