RF Amplifiers ADPA7002CHIP product image

ADPA7002CHIP

  • Description:IC RF AMP GPS 20GHZ-44GHZ DIE
  • Series:-
  • Mfr:Analog Devices Inc.
  • Package:Tray

SKU:817cd657b7fe Category: Brand:

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ADPA7002CHIP is listed in the RF Amplifiers range at ChipApex. The manufacturer field lists Analog Devices Inc.. Its product description is IC RF AMP GPS 20GHZ-44GHZ DIE. Review the specifications below when checking this part for your BOM.

RF Amplifiers specifications for ADPA7002CHIP

  • Description:IC RF AMP GPS 20GHZ-44GHZ DIE
  • Series:-
  • Mfr:Analog Devices Inc.
  • Package:Tray
  • Frequency:20GHz ~ 44GHz
  • P1dB:28dBm
  • Gain:15dB
  • Noise Figure:5dB
  • RF Type:General Purpose
  • Voltage - Supply:5V
  • Current - Supply:600mA
  • Test Frequency:34GHz ~ 44GHz
  • Mounting Type:Surface Mount
  • Package / Case:Die
  • Supplier Device Package:Die
  • Grade:-
  • Qualification:-

RF Amplifiers datasheet and documents for ADPA7002CHIP

ADPA7002CHIP

RF Amplifiers Overview

The ADPA7002CHIP is a GaAs pHEMT MMIC distributed power amplifier operating from 20 GHz to 44 GHz. It delivers 15 dB small-signal gain, 28 dBm P1dB output power (34–44 GHz), and 40 dBm typical IP3. Powered by a single 5 V supply drawing 600 mA, it features internal 50 Ω I/O matching for easy MCM integration. The bare die measures 2.75 mm × 1.805 mm × 0.1 mm.

RF Amplifiers Feature Summary

  • Utilizes GaAs pHEMT technology for high-frequency performance
  • Features internal 50 Ohm input and output matching networks
  • Designed as a bare die for direct multi-chip module integration

RF Amplifiers Applications

  • Military and space systems
  • Test and measurement instrumentation

RF Amplifiers Procurement Notes

Verify the specific package variant required, as Analog Devices offers both the bare die (ADPA7002CHIP) and packaged versions (e.g., ADPA7002AEHZ). Confirm that your design supports flip-chip or wire-bonding of fragile air bridges if using the die. Check current availability status, as supply constraints may affect lead times for this RF component.

RF Amplifiers Selection Notes

Select the ADPA7002CHIP when a high-gain, wideband power amplifier is needed for Ka-band applications within a multi-chip module. Ensure the host PCB or substrate can accommodate the bare die dimensions and thermal requirements. Compare against packaged alternatives like the ADPA7002AEHZ if surface-mount assembly without custom carrier substrates is preferred.

RF Amplifiers Part Context

This component belongs to the ADPA7002 series of microwave amplifiers from Analog Devices. It represents the bare die version of the widely used ADPA7002 family, allowing system integrators to customize the packaging and interconnects for specialized high-reliability or compact form-factor designs in defense and aerospace sectors.

RF Amplifiers Replacement Considerations

The packaged equivalent is ADPA7002AEHZ. Other related parts include ADPA7006CHIP and ADPA7008CHIP for different frequency bands or power levels.

ADPA7002CHIPADPA7002CHIP

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