RF Amplifiers ADPA7008CHIP product image

ADPA7008CHIP

  • Description:IC RF AMP GPS 20GHZ-54GHZ DIE
  • Series:-
  • Mfr:Analog Devices Inc.
  • Package:Tray

SKU:737188f8c986 Category: Brand:

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ADPA7008CHIP is listed in the RF Amplifiers range at ChipApex. The manufacturer field lists Analog Devices Inc.. Its product description is IC RF AMP GPS 20GHZ-54GHZ DIE. Review the specifications below when checking this part for your BOM.

RF Amplifiers specifications for ADPA7008CHIP

  • Description:IC RF AMP GPS 20GHZ-54GHZ DIE
  • Series:-
  • Mfr:Analog Devices Inc.
  • Package:Tray
  • Frequency:20GHz ~ 54GHz
  • P1dB:30.5dBm
  • Gain:18.5dB
  • Noise Figure:6dB
  • RF Type:General Purpose
  • Voltage - Supply:4V ~ 5V
  • Current - Supply:1.5A
  • Test Frequency:20GHz ~ 54GHz
  • Mounting Type:Surface Mount
  • Package / Case:Die
  • Supplier Device Package:Die
  • Grade:-
  • Qualification:-

RF Amplifiers datasheet and documents for ADPA7008CHIP

ADPA7008CHIP

RF Amplifiers Overview

The ADPA7008CHIP is a gallium arsenide (GaAs) pseudomorphic high electron mobility transistor (pHEMT) monolithic microwave integrated circuit (MMIC) distributed power amplifier. It operates within the frequency range of 20 GHz to 54 GHz and delivers a saturated output power (PSAT) of 31 dBm (1 W). The device provides 17.5 dB of small signal gain and an output P1dB of 30 dBm typical from 22 GHz to 40 GHz. It features an integrated temperature-compensated on-chip power detector and requires a 5 V supply at 1500 mA. The RF input and outputs are internally matched to 50 Ω and DC blocked.

RF Amplifiers Feature Summary

  • Integrated temperature-compensated on-chip power detector for monitoring
  • Internally matched 50 Ω RF input and output interfaces with DC blocking
  • High linearity performance with typical IP3 of 37 dBm in specified bands

RF Amplifiers Applications

  • Electronic countermeasure systems
  • Test instrumentation equipment
  • Aerospace and defense radar applications

RF Amplifiers Procurement Notes

Verify component authenticity through authorized Analog Devices channels or certified distributors. Confirm RoHS compliance status as indicated in official documentation. Ensure handling procedures account for the bare die configuration and electrostatic discharge sensitivity inherent to MMIC components.

RF Amplifiers Selection Notes

Select this component for wideband Ka-band applications requiring high saturated power and linear operation. Consider the internal matching and DC blocking features to simplify board layout. Evaluate thermal management requirements due to the 1500 mA current draw and ceramic leadless package characteristics.

RF Amplifiers Part Context

This part is a bare die variant of the ADPA7008 series, designed for integration into higher-level assemblies. It shares specifications with the packaged ADPA7008 but lacks the external housing. The chip is inspected to meet MIL-STD-883 Method 2010, Condition B standards for quality assurance.

RF Amplifiers Replacement Considerations

The ADPA7008C-KIT is a related RoHS compliant evaluation kit version. Direct pin-compatible replacements are not explicitly documented; system redesign may be required for alternative MMICs.

ADPA7008CHIPADPA7008CHIP

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