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ADRF6518ACPZ-WP is listed in the RF Misc ICS And Modules range at ChipApex. The manufacturer field lists Analog Devices Inc.. Its product description is IC QUADRATURE MODULATOR 32LFCSP. Review the specifications below when checking this part for your BOM.
The ADRF6518ACPZ-WP is a dual-channel RF integrated circuit featuring programmable filters and variable gain amplifiers. It operates with a frequency range of 0 Hz to 1.1 GHz. The device supports digital control for gain and bandwidth settings, enabling flexible signal conditioning in baseband applications. It is housed in a 32-lead LFCSP_WQ package (5x5 mm) and functions within a temperature range of -40°C to +85°C. This component integrates mixed power and filter modes for versatile signal processing.
Verify the exact part number suffix against official Analog Devices documentation to confirm packaging type. The WP suffix indicates Waffle Pack packaging, distinct from tape and reel options. Confirm obsolescence status as this component may no longer be manufactured. Cross-reference datasheet revisions to ensure compatibility with current design requirements before procurement.
Select this component when dual-channel programmable filtering and variable gain are required in a compact form factor. Ensure system voltage requirements align with the 3.3 V supply specification. Consider the digital interface capabilities for controlling gain and bandwidth settings. Evaluate thermal performance within the specified operating temperature range for reliable operation in target environments.
This part belongs to the ADRF6518 family of RF ICs from Analog Devices. It shares core functionality with variants like the ADRF6518ACPZ-R7 but differs in packaging. The family provides integrated solutions for baseband signal processing. Check specific suffixes for packaging differences such as waffle pack versus tape and reel configurations.
The ADRF6518ACPZ-R7 is a confirmed substitute offering identical electrical specifications with tape and reel packaging instead of waffle pack. Verify that the change in packaging format does not impact automated assembly processes or inventory handling procedures.
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