ADT7476ARQZ-REEL

Thermal Management Overview

The ADT7476ARQZ-REEL is a remote thermal controller and temperature monitor manufactured by onsemi. It operates within a supply voltage range of 3 V to 3.6 V and supports an operating temperature range of -40°C to +125°C. The device features internal and external sensor inputs with an accuracy of ±2.5%. It utilizes an SMBus output interface and is housed in a 24-QSOP package. Key functional blocks include an ADC, comparator, fan speed counter, multiplexer, and register bank.

Thermal Management Feature Summary

• Integrated fan control and temperature monitoring capabilities
• Supports both internal and external sensor configurations
• Digital communication via SMBus interface
• Includes built-in fan speed counting functionality

Thermal Management Applications

• System thermal management
• Fan speed control loops
• Temperature monitoring in electronic equipment

Thermal Management Procurement Notes

Verify the exact part number suffix against official documentation, as variations such as REEL or R7 may indicate different packaging formats while retaining identical electrical specifications. Confirm component status, as this specific model is listed as obsolete in available records. Ensure compatibility with existing SMBbus protocols and QSOP footprint requirements during procurement planning.

Thermal Management Selection Notes

Select this component for applications requiring integrated thermal regulation and fan control within a single IC. The wide operating temperature range makes it suitable for industrial environments. Verify that the system design accommodates the 24-pin QSOP package dimensions and that the host processor supports the required SMBus communication protocol for configuration and data retrieval.

Thermal Management Part Context

This component belongs to the dBCool series of power management ICs from onsemi. It falls under the category of thermal management devices designed for motor, motion, and ignition controller systems. The device integrates multiple functions typically found in separate components, simplifying board layout and reducing overall system complexity for thermal regulation tasks.

Thermal Management Replacement Considerations

Public confirmed substitute part numbers are not available in the provided source material.